INTERNATIONAL PATENT: RADISURF, INC., YIELD ENGINEERING SYSTEMS, INC. FILES APPLICATION FOR "SURFACE POLYMERS OF AT LEAST TWO POLYMER MOLECULES AND METHODS OF FORMING THE SAME"

GENEVA, April 29 -- RADISURF, INC. (20400 Stevens Creek Blvd.Suite 800Cupertino, California 95014), YIELD ENGINEERING SYSTEMS, INC. (3178 Laurelview CT.Fremont, California 94538) filed a patent application (PCT/US2025/030793) for "SURFACE POLYMERS OF AT LEAST TWO POLYMER MOLECULES AND METHODS OF FORMING THE SAME" on May 23, 2025. With publication no. WO/2026/084762, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NIKOLAJSEN, Jakob Pagh (Nyvangsvej 10DK-8362 Horning), AGERGAARD, Asger Holm (Stjaervej 4, SoballeDK-8660 Skan...