GENEVA, March 11 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, CA 92121-1714) filed a patent application (PCT/US2025/038653) for "WORD ALIGNMENT FOR CHIP-TO-CHIP COMMUNICATION" on Jul 22, 2025. With publication no. WO/2026/049898, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ROHAM, Masoud (5775 Morehouse DriveSan Diego, CA 92121-1714), WINEMILLER, Chad, Everett (5775 Morehouse DriveSan Diego, CA 92121-1714), SON, Seuk (5775 Morehouse DriveSan Diego, CA 92121-1714), BOLKAR...