INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SHARING REDUNDANT LANES BETWEEN MODULES IN A MULTIPLE MODULE CONFIGURATION"

GENEVA, March 31 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/042567) for "SHARING REDUNDANT LANES BETWEEN MODULES IN A MULTIPLE MODULE CONFIGURATION" on Aug 19, 2025. With publication no. WO/2026/064058, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AKAVARAM, Santhosh Reddy (5775 Morehouse DriveSan Diego, CA 92121), DODDI, Ravindranath (5775 Morehouse DriveSan Diego, CA 92121), ANUMALA, Sridhar (5775 Morehouse...