INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "METHODS AND APPARATUS FOR MAPPING AND DEMAPPING A TRANSPORT BLOCK BASED ON LAYER SETS AND SUB-BANDS USING INTERLEAVING"

GENEVA, March 11 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/038205) for "METHODS AND APPARATUS FOR MAPPING AND DEMAPPING A TRANSPORT BLOCK BASED ON LAYER SETS AND SUB-BANDS USING INTERLEAVING" on Jul 18, 2025. With publication no. WO/2026/049887, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KHOSHNEVISAN, Mostafa (Qualcomm IncorporatedAttn: International IP Administration5775 Morehouse DriveSan Diego, Califor...