INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "FRAME CONFIGURED TO SUPPORT COOLING AND SHIELDING FOR AN INTEGRATED CIRCUIT DEVICE"

GENEVA, April 29 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/044581) for "FRAME CONFIGURED TO SUPPORT COOLING AND SHIELDING FOR AN INTEGRATED CIRCUIT DEVICE" on Sep 03, 2025. With publication no. WO/2026/084794, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GAO, Le (5775 Morehouse DriveSan Diego, California 92121), YU, Youmin (5775 Morehouse DriveSan Diego, California 92121), NIKFAR, Nader (5775 Morehouse Driv...