INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "ENHANCED DOWNLINK AND UPLINK COEXISTENCE TECHNIQUES FOR ELECTRONIC SHELF LABEL SYSTEMS"

GENEVA, April 29 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/049890) for "ENHANCED DOWNLINK AND UPLINK COEXISTENCE TECHNIQUES FOR ELECTRONIC SHELF LABEL SYSTEMS" on Oct 07, 2025. With publication no. WO/2026/084916, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): REDDY, Varun Amar (5775 Morehouse DriveSan Diego, California 92121-1714), AKKARAKARAN, Sony (5775 Morehouse DriveSan Diego, California 92121-1714)

Abs...