INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "ELECTRONIC DEVICE HAVING A SUBSTRATE EMPLOYING REDUCED AREA, ADDED METAL PAD(S) TO METAL INTERCONNECT(S) TO REDUCE AIR VOIDS IN SOLDER JOINTS"

GENEVA, April 29 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/049318) for "ELECTRONIC DEVICE HAVING A SUBSTRATE EMPLOYING REDUCED AREA, ADDED METAL PAD(S) TO METAL INTERCONNECT(S) TO REDUCE AIR VOIDS IN SOLDER JOINTS" on Oct 03, 2025. With publication no. WO/2026/084884, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SALMON, Jay Scott (5775 Morehouse DriveSan Diego, California 92121), BHAT, Anirudh (5775 Morehou...