INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "APPARATUS AND METHODS FOR ESTABLISHING LINK BANDWIDTHS WITHIN DIE INTERCONNECT ARCHITECTURES"

GENEVA, March 11 -- QUALCOMM INCORPORATED (5775 Morehouse DriveSan Diego, California 92121) filed a patent application (PCT/US2025/037143) for "APPARATUS AND METHODS FOR ESTABLISHING LINK BANDWIDTHS WITHIN DIE INTERCONNECT ARCHITECTURES" on Jul 10, 2025. With publication no. WO/2026/049875, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AKAVARAM, Santhosh Reddy (5775 MOREHOUSE DRIVESan Diego, California 92121), TRAN, Sang (5775 MOREHOUSE DRIVESan Diego, California 92121), DEVARAJU, Vydhik Sharma (5775 MOREHOUSE DRIVESan ...