GENEVA, May 9 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714), CHENG, Houfu (5775 Morehouse Drive, San DiegoCalifornia 92121-1714) filed a patent application (PCT/CN2024/128378) for "SHARING ARTIFICIAL INTELLIGENCE (AI) MODEL CAPABILITIES ACROSS DEVICES" on Oct 30, 2024. With publication no. WO/2026/090886, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California...