INTERNATIONAL PATENT: QORVO US, INC. FILES APPLICATION FOR "LOW-PROFILE SUBMODULE FOR MULTI-LEVEL SYSTEM-IN-PACKAGE INTEGRATION"

GENEVA, May 12 -- QORVO US, INC. (7628 Thorndike RoadGreensboro, North Carolina 27409) filed a patent application (PCT/US2025/049574) for "LOW-PROFILE SUBMODULE FOR MULTI-LEVEL SYSTEM-IN-PACKAGE INTEGRATION" on Oct 06, 2025. With publication no. WO/2026/096158, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MORRIS, Thomas Scott (7628 Thorndike RoadGreensboro, North Carolina 27409), CARPENTER, Charles E. (1818 S. Orange Blossom TrailApopka, Florida 32703), KO, Yong-Jae (10F, Haesung 1 Bldg, 504 Teheran-roGangnam-guSeoul 0...