International Patent: PROBABILISTIC SHAPING FOR MULTIPLE DATA PORTIONS WITH COUPLED DISTRIBUTIONS

GENEVA, July 2 -- QUALCOMM INCORPORATED filed a patent application (US2025/053819) for “PROBABILISTIC SHAPING FOR MULTIPLE DATA PORTIONS WITH COUPLED DISTRIBUTIONS”. With publication no. WO/2026/135834, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H04L 27/34

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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