GENEVA, June 26 -- OSRAM GMBH filed a patent application (EP2025/084422) for “PRINTED CIRCUIT BOARD COMPRISING A CLAMPING STRUCTURE FOR MOUNTING THE PRINTED CIRCUIT BOARD ON A CARRIER, IN PARTICULAR A HEAT SINK”. With publication no. WO/2026/119672, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 3/32
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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