GENEVA, July 6 -- ATOTECH DEUTSCHLAND GMBH & CO. KG filed a patent application (EP2025/086178) for “PRETREATMENT METHOD TO ENHANCE NON-ETCH ADHESION PROMOTION”. With publication no. WO/2026/139225, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C23F 1/18
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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