International Patent: PRESSURE SENSITIVE CHIP AND PRESSURE SENSOR

GENEVA, Sept. 7 -- BOE TECHNOLOGY GROUP CO., LTD. filed a patent application (CN2025/080072) for “PRESSURE SENSITIVE CHIP AND PRESSURE SENSOR”. With publication no. WO/2026/178905, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01L 1/22

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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