International Patent: PRESSURE SENSING CHIP AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC PRODUCT

GENEVA, Sept. 7 -- BOE TECHNOLOGY GROUP CO., LTD. filed a patent application (CN2025/080093) for “PRESSURE SENSING CHIP AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC PRODUCT”. With publication no. WO/2026/178914, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01L 9/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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