International Patent: PREPREG, CURED PRODUCT OF PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

GENEVA, July 6 -- RESONAC CORPORATION filed a patent application (JP2025/045454) for “PREPREG, CURED PRODUCT OF PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/141518, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08J 5/24

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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