International Patent: PREFETCHING AND CACHING BETWEEN HIGH BANDWIDTH MEMORY (HBM) AND NON-VOLATILE (NVM) CACHE ON PROCESSING DIE

GENEVA, July 9 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/061755) for “PREFETCHING AND CACHING BETWEEN HIGH BANDWIDTH MEMORY (HBM) AND NON-VOLATILE (NVM) CACHE ON PROCESSING DIE”. With publication no. WO/2026/148074, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 12/0862

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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