International Patent: PRECISION ALIGNMENT FEATURES FOR HIGH DENSITY INTERCONNECTS

GENEVA, July 27 -- RAYTHEON COMPANY filed a patent application (US2026/011268) for “PRECISION ALIGNMENT FEATURES FOR HIGH DENSITY INTERCONNECTS”. With publication no. WO/2026/156076, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 1/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....