GENEVA, Oct. 30 -- INTERNATIONAL BUSINESS MACHINES CORPORATION filed a patent application (EP2026/060156) for “POWER DELIVERY AND COOLING OF 3D STACKED MULTI-CHIPLET MODULES”. With publication no. WO/2026/223983, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 90/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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