GENEVA, Aug. 31 -- TOKYO OHKA KOGYO CO., LTD. filed a patent application (JP2026/004606) for “POROUS FILM, METHOD FOR PRODUCING POROUS FILM, AND METHOD FOR PRODUCING PURIFIED CHEMICAL LIQUID FOR USE IN PRODUCTION OF SEMICONDUCTOR ELEMENT”. With publication no. WO/2026/176985, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B01D 71/64
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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