GENEVA, Oct. 9 -- SHIKOKU KASEI HOLDINGS CORPORATION filed a patent application (JP2026/009100) for “POROUS COPPER FILM MATERIAL, ELECTROMAGNETIC WAVE SHIELDING MATERIAL, AND METHOD FOR PRODUCING POROUS COPPER FILM MATERIAL”. With publication no. WO/2026/211196, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 9/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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