GENEVA, April 28 -- POLYRAM PLASTIC INDUSTRIES LTD (1920500 Ram-On) filed a patent application (PCT/IL2025/050892) for "NOVEL TIE LAYER COMPOSITION" on Oct 05, 2025. With publication no. WO/2026/083407, the details related to the patent application was published on Apr 23, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): DVIR, Haim (13/4 Klil HaHoresh3687012 Nesher), BORIKIN, Denis (BORIKIN, Denis3280703 Haifa), LIPHSHITS, Tal (12A Hamakabim1829612 Afula)
Abstract: A tie layer composition with improved bonding in polypropylene multi-layer structures, and improved bonding in general under ret...