GENEVA, Sept. 18 -- MITSUBISHI CHEMICAL CORPORATION filed a patent application (JP2026/007907) for “POLYMER, COMPOSITION, COMPOSITION FOR ADHESIVE LAYER FORMATION, AND COMPOSITION FOR TEMPORARY FIXATION ADHESIVE LAYER FORMATION”. With publication no. WO/2026/186724, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 59/18
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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