GENEVA, July 6 -- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. filed a patent application (CN2025/135707) for “POLISHING METHOD, POLISHING HEAD, FINAL POLISHING APPARATUS, AND SILICON WAFER”. With publication no. WO/2026/138262, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B24B 37/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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