GENEVA, Oct. 5 -- FUJIMI INCORPORATED filed a patent application (JP2026/011133) for “POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE”. With publication no. WO/2026/204795, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 52/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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