GENEVA, Oct. 22 -- BONDER, INC. filed a patent application (US2025/032496) for “PLATFORM FOR FACILITATING COMMUNICATION BETWEEN CUSTOMER DEVICES AND BACK-END SERVER FOR RETAIL LOCATION”. With publication no. WO/2025/255372, here are the other details related to the patent application:
Kind: Corrected version of pamphlet [A9]
IPC: H04W 4/021
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....