International Patent: PLASMA ETCHING APPARATUS AND ETCHING METHOD USING REUSABLE MASK

GENEVA, Oct. 22 -- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) filed a patent application (KR2026/095788) for “PLASMA ETCHING APPARATUS AND ETCHING METHOD USING REUSABLE MASK”. With publication no. WO/2026/221408, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01J 37/305

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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