GENEVA, Nov. 6 -- BENEQ OY filed a patent application (FI2026/050222) for “PLASMA-ENHANCED ATOMIC LAYER DEPOSITION APPARATUS”. With publication no. WO/2026/229655, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 14/60
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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