GENEVA, July 2 -- SHANGHAI MEADVILLE ELECTRONICS CO., LTD. filed a patent application (CN2025/091795) for “PICOSECOND LASER PROCESSING METHOD FOR BONDING PAD AT BOTTOM OF BLIND SLOT”. With publication no. WO/2026/129529, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 3/18
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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