GENEVA, Oct. 15 -- HD MICROSYSTEMS, LTD. filed a patent application (JP2025/013934) for “PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PATTERNED CURED PRODUCT, PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT”. With publication no. WO/2026/215962, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/004
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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