GENEVA, July 1 -- ACM RESEARCH (SHANGHAI) , INC. filed a patent application (CN2025/131684) for “PANEL METAL DEPOSITION AND THINNING DEVICE”. With publication no. WO/2026/124032, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C25D 19/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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