GENEVA, June 19 -- SHANGHAI WANSHENG ALLOY MATERIALS CO., LTD. filed a patent application (CN2025/083339) for “PALLADIUM-PLATED/GOLD-PALLADIUM-PLATED COPPER BONDING WIRE WITH HIGH CORROSION RESISTANCE AND HIGH CONDUCTIVITY, AND PRODUCTION PROCESS THEREFOR”. With publication no. WO/2026/102972, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C25D 5/10
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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