International Patent: PACKAGE STRUCTURE INTEGRATING OPTICAL ELEMENT AND PHOTOSENSITIVE DEVICE, AND MANUFACTURING METHOD THEREFOR

GENEVA, July 6 -- HANGZHOU HIKMICRO SENSING TECHNOLOGY CO., LTD. filed a patent application (CN2025/144279) for “PACKAGE STRUCTURE INTEGRATING OPTICAL ELEMENT AND PHOTOSENSITIVE DEVICE, AND MANUFACTURING METHOD THEREFOR”. With publication no. WO/2026/138726, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10F 39/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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