International Patent: PACKAGE-ON-PACKAGE DEVICE WITH REDISTRIBUTION DIE

GENEVA, June 26 -- QUALCOMM INCORPORATED filed a patent application (US2025/053797) for “PACKAGE-ON-PACKAGE DEVICE WITH REDISTRIBUTION DIE”. With publication no. WO/2026/122246, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 90/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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