GENEVA, Sept. 7 -- QUALCOMM INCORPORATED filed a patent application (US2026/014751) for “PACKAGE COMPRISING A HEAT SINK”. With publication no. WO/2026/182918, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 72/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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