International Patent: PACKAGE COMPRISING A DEVICE WITH A CAPACITOR COMPRISING VERTICALLY ALIGNED CAPACITOR INTERCONNECTS

GENEVA, July 2 -- QUALCOMM INCORPORATED filed a patent application (US2025/057924) for “PACKAGE COMPRISING A DEVICE WITH A CAPACITOR COMPRISING VERTICALLY ALIGNED CAPACITOR INTERCONNECTS”. With publication no. WO/2026/135993, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 44/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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