International Patent: PACKAGE COMPATIBLE WITH PACKAGE ASSEMBLY INCLUDING COMPONENTS HAVING AN OFFSET CONFIGURATION

GENEVA, July 2 -- QUALCOMM INCORPORATED filed a patent application (US2025/056186) for “PACKAGE COMPATIBLE WITH PACKAGE ASSEMBLY INCLUDING COMPONENTS HAVING AN OFFSET CONFIGURATION”. With publication no. WO/2026/135913, here are the other details related to the patent application:

Kind: Initial Publication without ISR [A2]

IPC: none

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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