INTERNATIONAL PATENT: PAC WORLDWIDE CORPORATION FILES APPLICATION FOR "CLOSURE FLAP FOR MAILER PACKAGE AND METHOD OF UTILIZATION"

GENEVA, March 11 -- PAC WORLDWIDE CORPORATION (15435 NE 92nd St.Redmond, Washington 98052) filed a patent application (PCT/US2025/043396) for "CLOSURE FLAP FOR MAILER PACKAGE AND METHOD OF UTILIZATION" on Aug 25, 2025. With publication no. WO/2026/050178, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KENDALL, Brian Andrew (883 Ascot DriveMaineville, Ohio 45039), FULLERTON, Murray (95A Anzac RoadPukekohe, 2120), FREDERICK, Paul Andrew (4389 Perin LaneHarrison, Ohio 45030)

Abstract: A mailer package includes a closure fl...