International Patent: OUTER PACKAGING MATERIAL FOR VACUUM INSULATION MATERIAL, VACUUM INSULATION MATERIAL, ARTICLE WITH VACUUM INSULATION MATERIAL, AND BARRIER FILM

GENEVA, Oct. 1 -- DAI NIPPON PRINTING CO., LTD. filed a patent application (JP2026/009714) for “OUTER PACKAGING MATERIAL FOR VACUUM INSULATION MATERIAL, VACUUM INSULATION MATERIAL, ARTICLE WITH VACUUM INSULATION MATERIAL, AND BARRIER FILM”. With publication no. WO/2026/192019, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: F16L 59/065

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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