GENEVA, April 19 -- ORIGIN COMPANY, LIMITED (3-3-27, Sakawa, Sakura-ku, Saitama-shi, Saitama3380823), 株式会社オリジン (埼玉県さいたま市桜区栄和３丁目３番２７号) filed a patent application (PCT/JP2025/033864) for "SOLDERING DEVICE AND PRODUCTION METHOD FOR SOLDERED OBJECT" on Sep 25, 2025. With publication no. WO/2026/079151, the details related to the patent application was published on Apr 16, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO...