GENEVA, Oct. 1 -- QUALCOMM INCORPORATED filed a patent application (US2026/015534) for “OPTIMIZATION OF DUAL-CONNECTIVITY BETWEEN USER EQUIPMENT AND RADIO ACCESS NETWORKS”. With publication no. WO/2026/192722, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H04W 74/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....