GENEVA, Aug. 21 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2026/074990) for “OPTICAL MODULE, COMMUNICATION METHOD, AND CHIP”. With publication no. WO/2026/170994, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04B 10/25
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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