International Patent: OPTICAL INTERCONNECT MODULE WITH TRANSVERSELY EXTENDED ALIGNMENT FEATURES

GENEVA, Sept. 24 -- SAMTEC, INC. filed a patent application (US2026/019332) for “OPTICAL INTERCONNECT MODULE WITH TRANSVERSELY EXTENDED ALIGNMENT FEATURES”. With publication no. WO/2026/198422, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G02B 6/42

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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