International Patent: OPTICAL FIBER BUNDLE STRUCTURE, OPTICAL FIBER CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING OPTICAL FIBER BUNDLE STRUCTURE

GENEVA, Oct. 15 -- SUMITOMO ELECTRIC INDUSTRIES, LTD. filed a patent application (JP2026/013979) for “OPTICAL FIBER BUNDLE STRUCTURE, OPTICAL FIBER CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING OPTICAL FIBER BUNDLE STRUCTURE”. With publication no. WO/2026/216446, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G02B 6/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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