GENEVA, July 9 -- KONDALA RAO, Yadlapalli filed a patent application (IN2025/050592) for “NOVEL SYSTEM FOR ENHANCING THERMOMECHNICAL EFFICIENCY AND REDUCING EMISSIONS AND NOISE LEVELS IN IC ENGINES”. With publication no. WO/2026/146511, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01J 37/32
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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