INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "THREE-DIMENSIONAL VERTICAL POWER SUPPLY STRUCTURE INTEGRATED WITH MICRO-CHANNELS AND MANUFACTURING METHOD THEREFOR"

Posted On: 2026-04-04

GENEVA, April 4 -- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD (Huajin Semiconductor Phase 2, No. 2 Jingxian Road, Xinwu DistrictWuxi, Jiangsu 214135), 华进半导体封装先导技术研发中心有限公司 (中国江苏省无锡市新吴区景贤路2号华进半导体2期) filed a patent application (PCT/CN2025/099239) for "THREE-DIMENSIONAL VERTICAL POWER SUPPLY STRUCTURE INTEGRATED WITH MICRO-CHANNELS, AND MANUFACTURING METHOD THEREFOR" on Jun 05, 2025. With publication no. WO/2026/066216, the details related to the patent application...

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इस लेख के रीप्रिंट को खरीदने या इस प्रकाशन का पूरा फ़ीड प्राप्त करने के लिए, कृपया हमे संपर्क करें.

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INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "THREE-DIMENSIONAL VERTICAL POWER SUPPLY STRUCTURE INTEGRATED WITH MICRO-CHANNELS AND MANUFACTURING METHOD THEREFOR"