GENEVA, June 24 -- QUALCOMM INCORPORATED filed a patent application (US2025/050047) for “MULTIPLEXING AND BUNDLING TECHNIQUES FOR FEEDBACK COMMUNICATIONS”. With publication no. WO/2026/117315, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04L 1/1607
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....