GENEVA, July 6 -- SANDISK TECHNOLOGIES, INC. filed a patent application (US2025/026004) for “MULTILAYER TRENCH CAPACITOR AND METHOD OF MAKING THE SAME”. With publication no. WO/2026/080103, here are the other details related to the patent application:
Kind: Later publication of international search report [A3]
IPC: H10D 1/66
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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