GENEVA, July 27 -- TOYOBO CO., LTD. filed a patent application (JP2025/045034) for “MULTILAYER POLYESTER FILM FOR BONDING METAL PLATE, LAMINATED METAL PLATE, METAL CONTAINER, AND METHODS FOR PRODUCING THOSE”. With publication no. WO/2026/154933, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B32B 27/36
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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