GENEVA, Oct. 1 -- QUALCOMM INCORPORATED filed a patent application (US2026/017020) for “MULTICHIP MODULE INCLUDING FOLDED SUBSTRATE”. With publication no. WO/2026/192779, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 90/22
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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